• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to a lead frame and a semiconductor package using the same. The lead frame according to the present invention includes a paddle which is down-set in the center, a tie bar for supporting the paddle, and a wire bond with the conduction path of the paddle. A fixed inner lead, an out lead connected to the inner lead and connected to a power supply, and a side rail for supporting the paddle, the inner and the out lead.
    公开号:KR19980053676A
    申请号:KR1019960072804
    申请日:1996-12-27
    公开日:1998-09-25
    发明作者:김성호
    申请人:김영환；현대전자산업 주식회사；
    IPC主号:
    专利说明:

    Lead frame and semiconductor package using same.
    BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package, and more particularly, to a lead frame and a semiconductor package using the same, which can perform a packaging process without being affected by the size or paddle position of a chip.
    The integrated circuit semiconductor chip formed by a conventional method is sent to an assembly process and packaged through a sequence of chip cutting, chip attaching, wire bonding, mold, forming, trimming, and the like.
    A semiconductor package and a lead frame according to the prior art will be described with reference to FIGS. 1 and 2 as follows.
    1 is a cross-sectional view for describing a general semiconductor package, in which a semiconductor chip 1 is attached to a paddle 2s by an adhesive such as epoxy, and the chip 1 is used to form an electrical signal transmission path to the outside. It is bonded by the metal wire 3 to the inner lead 2b. Subsequently, an encapsulation body 4 is formed to seal a predetermined area including the chip 1 and the inner lead 2b wire-bonded thereto by using a molding compound, and a subsequent process is performed to form a Gull-type out lead ( 2c).
    FIG. 2 is a plan view of a lead frame, the paddle 11 being downset in the center of the lead frame, a tie bar 12 for supporting the paddle 11, and the paddle An inner lead 13 of a predetermined shape that is wire-bonded with a chip attached on the 11, an out lead 14 connected to the inner lead 13 and connected to a power supply, the paddle 11, an inner It consists of a side rail 15 for supporting the lead 13 and the out lead 14.
    However, in the above conventional technology, since the shape of the inner lead and the size of the paddle have to vary according to the chip size and the paddle position, the lead frame manufacturing cost is high, and the wire bonding between the inner lead and the semiconductor chip having a small height difference is required. By this formation, there was a problem that the wire was easily disconnected due to slight paddle position variation.
    Therefore, in order to solve the above problems, the present invention manufactures a fixed type of inner lead, and forms an insulating layer having a conduction path on the paddle, and then the inner lead and the conduction path and the conduction. An object of the present invention is to provide a lead frame manufacturing method capable of improving the reliability of a semiconductor package by connecting an induction path and a chip.
    1 is a cross-sectional view for explaining a semiconductor package according to the prior art.
    Figure 2 is a plan view for explaining a lead frame according to the prior art.
    3 is a plan view for explaining a lead frame according to the present invention.
    4 is a cross-sectional view illustrating a semiconductor package according to the present invention.
    5 is a plan view showing an insulating layer having a conduction path according to the present invention.
    Explanation of symbols on the main parts of the drawings
    21, 31: paddle 22: tie bar
    23, 35: inner lead 24: out lead
    25 side rail 32 insulation layer
    33: conduction pass 34: semiconductor chip
    36: metal wire
    An object of the present invention as described above, the paddle is formed downset in the center of the lead frame, the insulating layer having a conduction path formed thereon, tie bars for supporting the paddle, the conduction path of the paddle According to the present invention, the inner lead is fixed to the wire and the outer lead is connected to the inner lead and connected to the power supply, and the side rail for supporting the paddle, the inner and the out lead Achieved by a lead frame.
    It is also an object of the present invention to form an insulating layer having a conduction path on a paddle; Attaching a semiconductor chip on the insulating layer having the conduction path; And wire-bonding the inner lead and the conduction path and the conduction path and the semiconductor chip.
    According to the present invention, the reliability of a semiconductor package can be improved by wire bonding a fixed inner lead, a conduction path, a conduction path, and a semiconductor chip.
    EXAMPLE
    Hereinafter, exemplary embodiments of the present invention will be described in more detail with reference to FIGS. 3 to 5.
    3 is a plan view illustrating a lead frame according to the present invention, in which the lead frame includes a paddle 21 formed at the center, a tie bar 22 for supporting the paddle 21, a chip size and a paddle 21. Inner lead 23 is fixed, irrespective of the movement of), the out lead 24 is connected to the inner lead 23 and connected to the power supply, the paddle 21, the inner lead 23 and It consists of a side rail 25 for supporting the out lead 24.
    FIG. 4 illustrates a semiconductor package according to the present invention. An insulating layer 32 having a conductive path 33 is formed on a paddle 31, and a non-conductive epoxy is formed on the insulating layer 32. To attach the semiconductor chip 34. In this case, the conduction path 33 is formed of gold, silver, copper, or the like. Then, the conductive path 33 of the fixed inner lead 35 and the insulating layer 32 is bonded using a metal wire, and the conductive path 33 and the semiconductor chip 34 are wire bonded. do.
    5 shows an insulating layer 34 having the conduction path 33, in which the conduction path 33 of the radial structure is wire bonded to each inner lead 35 in a subsequent process.
    Therefore, in the wire bonding according to the prior art, since the height difference between the inner lead and the semiconductor chip is small, it can be easily disconnected due to the size variation of the chip and the position of the paddle. When wire bonding the induction path and the semiconductor chip, since the height of the wire bonding is large, the semiconductor package can be formed without being affected by the size of the chip and the positional change of the paddle.
    As described above, the lead frame of the present invention and the semiconductor package using the same manufacture a fixed inner lead, and form an insulating layer having a conduction pass on the paddle, and then the inner lead and the conduction path and the conduction. By connecting the pass and the chip, it is possible to prevent the manufacturing cost of the lead frame and the disconnection of the wire, thereby improving the reliability of the semiconductor package.
    Meanwhile, although specific embodiments of the present invention have been described and illustrated, modifications and variations can be made by those skilled in the art. Accordingly, the following claims are to be understood as including all modifications and variations as long as they fall within the true spirit and scope of the present invention.
    权利要求:
    Claims (4)
    [1" claim-type="Currently amended] It is formed down the center of the lead frame,
    A paddle having an insulating layer having a conduction path thereon;
    Tie bars for supporting the paddles,
    An inner lead wire-bonded with the conduction pass of the paddle,
    A lead frame comprising an out lead connected to the inner lead and connected to a power supply, and a side rail for supporting the paddle, the inner and the out lead,
    The lead frame has a fixed shape regardless of the size of the chip and the paddle position.
    [2" claim-type="Currently amended] Forming an insulating layer having a conduction path on the paddle;
    Attaching a semiconductor chip on the insulating layer having the conduction path; And
    And wire-bonding the inner lead and the conduction path and the conduction path and the semiconductor chip.
    [3" claim-type="Currently amended] The semiconductor package of claim 2, wherein the conduction path has a radial structure.
    [4" claim-type="Currently amended] The semiconductor package of claim 2, wherein the conduction path is formed of one selected from gold, silver, and copper.
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    同族专利:
    公开号 | 公开日
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1996-12-27|Application filed by 김영환, 현대전자산업 주식회사
    1996-12-27|Priority to KR1019960072804A
    1998-09-25|Publication of KR19980053676A
    优先权:
    申请号 | 申请日 | 专利标题
    KR1019960072804A|KR19980053676A|1996-12-27|1996-12-27|Lead frame and semiconductor package using same|
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